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Sn63Pb37 Eutectic Alloy (63% Tin, 37% Lead) |
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0.2mm to 0.76mm (Standard)|Custom Sizes Available |
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<5μm Precision (±0.005mm) |
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Standard 183℃|Custom Melting Points Optional |
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250,000 pcs/Bottle, Vacuum-Sealed Anti-Oxidation |
Ensures minimal voiding and bright, reliable joints for high-density PCB assembly.
Eutectic composition prevents phase separation, reducing cold joints risk.
Tailor diameter/melting point for specialized applications (e.g., low-temperature Bi58 alloys).
Ideal for flip-chip, CSP, and micro-BGA underfills.
Micro-connections in sensors, medical devices, and aerospace modules.
Uniform spheres for consistent plating thickness.
- Standards: Conforms to IPC & RoHS exemptions for critical electronics.
- Testing: 100% optical inspection, shear strength >=45MPa.
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